Semiconductor package structures having liquid cooler integrated with first level chip package modules

ABSTRACT

Semiconductor package structures are provided which are designed to have liquid coolers integrally packaged with first level chip modules. In particular, apparatus for integrally packaging a liquid cooler device within a first level chip package structure include structures in which a liquid cooler device is thermally coupled directly to the back side of an integrated circuit chip flip-chip mounted on flexible chip carrier substrate. The liquid cooler device is mechanically coupled to the package substrate through a metallic stiffener structure that is bonded to the flexible package substrate to provide mechanical rigidity to the flexible package substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This is a Continuation Application of U.S. application Ser. No.12/120,029 filed on May 13, 2008, the disclosure of which is hereinincorporated by reference in its entirety.

BACKGROUND

1. Technical Field

The present invention relates generally to semiconductor packagestructures having liquid coolers integrally packaged with first levelchip modules and, more specifically, apparatus and methods forintegrally packaging a liquid cooler device with in a first level chippackage structure wherein the liquid cooler device is thermally coupleddirectly to the back side of an integrated circuit chip flip-chipmounted on flexible chip carrier substrate, and wherein the liquidcooler device is mechanically coupled to the package substrate through ametallic stiffener structure that is bonded to the flexible packagesubstrate to provide mechanical rigidity to the flexible packagesubstrate.

2. Discussion of Related Art

Technological innovations in semiconductor fabrication and packagingtechnologies have enabled development of high performance, and highintegration density semiconductor chip modules. As chip geometries arescaled down and operating speeds are increased and chip packages becomemore compact, however, power densities are increased resulting in moreheat generation per unit area. The increased power density posespractical limitations to the level of integration density andperformance that may be achieved. Indeed, the ability to implement chipmodules with higher densities and higher performance is limitedprimarily by the ability to effectively cool the chip modules duringnormal operation. For instance, as heat is generated by IC chips duringnormal operation, cooling structures must be employed to providesufficiently low thermal resistance paths between the chips and ambientair or a circulating liquid coolant to adequately remove heat andmaintain the operating temperature of the chips low enough to assurecontinued reliable operation. In high performance, high density chippackage structures, air cooling solutions are not capable of removingheat due to very high power density or due to space and/or air flowlimitations, thereby requiring liquid cooling solutions (e.g., watercoolant).

Moreover, effective cooling solutions are important in high performance,high density package structures to minimize mechanical stresses that mayoccur over temperature cycling (caused by power cycling) due to thedifferences in thermal expansion between different components of thechip package structure. More specifically, package components formedfrom materials having different coefficients of thermal expansion (CTE)tend to expand and contract by different amounts during thermal cycling,which is a phenomenon known as “CTE mismatch”. The CTE represents theratio of change in dimensions to original dimensions per degree rise intemperature, expressed in ppm/° C. CTE mismatch denotes the differencein the coefficients of thermal expansions of two materials or componentsjoined together, which produces strains and stresses at joininginterfaces or in attachment surfaces.

By way of example, in conventional packaging technologies, chip levelpackages can be constructed with one or more chips mounted on a thinflexible first level package substrate, such as an organic laminatebuild up package substrate, using micro solder bump connections,referred to as C4's (controlled collapse chip connection). A key issuewith first level organic package substrates is the CTE mismatch betweensilicon chips (˜3 ppm/C) and the composite laminate carrier substrate(15-20 ppm/C) to which the chips are attached via C4s. Such CTE mismatchcan result in mechanical stresses on the C4 connections between the chipand the organic carrier substrate during thermal cycling. As thesemechanical stresses are applied over repeated thermal cycles, the C4connections may become fatigued and fail. To counteract stress to C4connections, underfill materials may be applied between the chip andcarrier to protect the C4 solder bumps.

Moreover, even when underfill material is used to maintain thestructural integrity of C4 contacts, the stress generated by the CTEmismatch between the silicon chip and organic substrate, for example,can result in bowing or bending of substrates and chips. For instance,the differences in thermal expansion between the silicon chip and theorganic carrier substrate can cause the chip to warp by 60 microns ormore after processing, and cause the substrate to be even moresubstantially warped. Such bending/bowing can not only generatesignificant stresses and strains in the electrical contacts between thechip and substrate, but the chip may be subjected to a high tensilestress, so a small defect or scratch can result in chip cracking ordelamination of the organic substrate layers. This warpage resultingfrom CTE mismatch between silicon chip and organic carrier substrateduring thermal cycling becomes worse as the chip size increases and thisis particularly problematic for lidless packages where the backsidesurface of the chip is exposed.

To counteract possible warping of package, various types of mechanicalstiffening structures may be employed to provide mechanical rigidity toflexible package substrates such as polymer substrates and organiclaminate build up package substrates. For instance, conventionalpackaging techniques utilize mechanical stiffener structures, e.g.,planar stiffener plates, package lid structures, and a combination ofstiffener plates and package lid structures, which are bonded to packagesubstrates in ways that counteract mechanical stresses arising fromdifferential thermal expansion between chip and substrate, for example,to reduce flexure during thermal cycling and otherwise improve theoverall structural reliability of the package. Various conventionalsemiconductor chip package structures in which mechanical stiffeningstructures are used with first level SCM (single chip module) chippackages to reduce flexure, will be now be discussed in detail belowwith reference to FIGS. 1A/B, 2A/B and 3.

FIGS. 1A and 1B schematically illustrate an embodiment of an electronicmodule (10) having a conventional framework for packaging a single chipmodule (SCM) with a liquid cooling module onto a circuit board (20). Inparticular, FIG. 1A is a schematic side view of an electronic module(10) comprising a circuit board (20) (PCB, node card, printed wiringboard, printed circuit card, etc.), a 1^(st) level chip package (30) andcooler device (40) in a stacked configuration. The chip package (30)generally comprises an organic laminate package substrate (31) (or “chipcarrier”), an IC (integrated circuit) chip (32), and a package lid (33).The cooler (40) is mechanically attached to the circuit board (20) usingan attachment device (50). FIG. 1B is a schematic top plan view of theelectronic module (10) along line 1B-1B in FIG. 1A, excluding thepackage lid (33), cooler device (40) and attachment devices (50).

As depicted in FIGS. 1A and 1B, the semiconductor IC chip (32) isflip-chip mounted to a top-side surface of the chip carrier substrate(31) using an array of fine pitch solder balls (34) such as C4(Controlled Collapsed Chip Connect) solder balls that provide electricalconnections between an array of I/O pads on the active surface of thechip (32) and a footprint of corresponding I/O pads on the top-sidesurface of the chip carrier substrate (31). The IC chip (32) ismechanically coupled to the organic chip carrier substrate (31) using anunderfill material (35) disposed between the IC chip (32) and theorganic chip carrier (31) encapsulating the C4 connections (34). Thechip (32) is disposed in a central region of the substrate (31) andsurrounded by underfill material (35) which extends beyond the edge ofthe chip (32) to form a fillet. The underfill material (35) (e.g.,epoxy) is a rigid material that serves to redistribute mechanicalstresses in the interface between the chip (32) and the carriersubstrate (31) caused by the CTE mismatch between the chip carrier (31)and the chip (32), to thereby minimize stress applied to the C4connections (34). Other devices such as decoupling capacitors (37) areshown mounted on the first surface of the chip carrier (31) using microsolder balls. In FIG. 1B, the decoupling capacitors (37) are shown to beplaced along two opposite sides of the chip (32).

The chip carrier substrate (31) may comprise electrical contacts formedon the first surface thereof to provide electrical interconnectionsbetween the chip (32) and devices (37) using wiring inside the substrate(31) (not shown). As depicted in FIG. 1A, an array of larger pitchsolder balls (36) provide electrical connections between an array ofcontact pads formed on a second major (bottom) surface of the substrate(31) and a corresponding array of I/O contacts formed on the top surfaceof the circuit board (20), providing an area array connection known as aball grid array (BGA). The circuit board (20) includes a plurality ofwiring layers (21) that are connected to one or more plated throughholes (22). The plated through holes (22) provide electrical connectionsbetween the array of I/O contacts on the top surface of the board (20)with the wiring layers (21) connected to the plated through holes (22).

In the exemplary framework of FIGS. 1A-B, the package lid (33) functionsas a mechanical stiffener member and a heat spreader. The package lid(33) includes an outer rim (33 a) that surrounds and defines a lidcavity (33 b) region that encloses the integrated circuit chip (32) andother devices (37) when the package lid (33) is mounted to the chipcarrier (31). The package lid (33) is attached to the chip carrier (31)by bonding the lid outer rim (33 a) to the outer peripheral surfaceregion of the chip carrier (31) using a layer of adhesive material (38).In this regard, the package lid (33) serves as a stiffener member thatprovides supports for the chip carrier substrate (31) to counteractthermal/mechanical stresses and reduce semiconductor package warpage andimprove the overall reliability. The package lid (33) can be made ofcopper with a thickness of 0.5 mm to 2.0 mm. The package lid (33) designcan vary depending on the application but the package lid (33) design isan important consideration in the overall package framework as a packagelid which is too thick and too stiff can result in excessive stress andfailure in the package.

The package lid (33) also serves as a heat spreader for cooling the ICchip (32) wherein the package lid (33) extends over the back surface ofthe chip (32) wherein the inner surface of the lid cavity (33 b) isthermally coupled to the backside of the chip (32) using a layer ofthermal interface material (TIM) (39). The TIM layer (39) is typicallyformed of a mechanically compliant, thermally conductive material whichprovides mechanical compliance and serves as a primary thermal path totransfer heat from the IC chip (32) to the package lid (33). The packagelid (33) is thermally coupled to the cooling device (40) using a secondlayer of TIM (45). The TIM layer (39), package lid (33) and second TIMlayer (45) provide a thermal path for conducting heat from the backsideof the chip (32) to the cooling device (40) where the heat is dissipatedby the cooling device (40) via air or liquid cooling. In theconventional framework of FIG. 1A, the second TIM layer (45) wouldtypically consist of a filled paste or grease, or a phase changematerial such as a filled wax, which are reworkable, as opposed to afilled adhesive or gel material which require curing at 100-150 C andare not easily reworkable. For most TIMs, the filler material has a highthermal conductivity such as silver, graphite, or ceramic particles, forexample. The first TIM layer (39) between the chip (32) and the bottomsurface of the package lid (33) would typically be a filled adhesive orgel material as opposed to a fluid material such as pastes or greasesthat could be “pumped out” by the package displacements during thermalcycling. This would be less of a concern for the second TIM layer (45)when, for instance, the cooler (40) and package lid (33) are formed ofthe same material, e.g., copper, or materials having similar CTEs

The cooling device (40) may be an air cooled heat sink or a liquidcooler device having a plurality of thermal fins (41) that define openchannels (42) through which air or liquid may flow to remove heat fromthe thermal fins (41). The cooler (40) is mechanically attached to themother board (20) using the attachment device (50) which is configuredto apply a compressive load to hold the cooler (40) against the topsurface of the package lid (33). As depicted in FIG. 1B, a plurality ofmounting holes (51) are formed through the mother board (20) inproximity to each corner of the carrier substrate (31) for insertablyreceiving the attachment devices (50). This attachment scheme useshardware that requires holes (51) to be formed in the electrical board(20) which blocks some wiring channels of the circuit board (20). Inthis conventional framework, the SCM chip package (30) would be attachedto the circuit board (20) by a solder reflow process if BGA or CGAelectrical interconnects are used, or plugged into a socket if PGAelectrical interconnects are used, or aligned to an LGA connector if LGAelectrical interconnects are used. The second TIM layer (45) would thenbe dispensed onto the lid (33), or the bottom of the cooler device (40),and they would be joined and the cooler device (40) secured to thecircuit board (20) by the attachment devices (50). As described above,it would be desirable to use a TIM2 (45) material which is reworkableand does not require curing at an elevated temperature.

FIGS. 2A and 2B schematically illustrate another embodiment of anelectronic module having a conventional framework for packaging a singlechip module (SCM) with a cooling module onto a circuit board (20). Inparticular, FIG. 2A is a schematic side view of an electronic module(11) including a printed circuit board (PCB) (20) (or node card, printedwiring board, or printed circuit card), a 1^(st) level chip package (60)and cooler device (40) in a stacked configuration with the chip package(60) interposed between the circuit board (20) and the cooler device(40). FIG. 2B is a schematic top plan view of the electronic module (11)along line 2B-2B in FIG. 2A excluding the planar package lid (64),cooler device (40) and attachment devices (50). Except for the firstlevel chip package (60), the electronic module (11) illustrated in FIGS.2A-B has a conventional framework that is similar to that of theelectronic module (10) in FIGS. 1A-1B, and therefore, a detailedexplanation is not required.

The chip level package (60) includes a separate stiffener member (62)and a planar package lid (64). As shown in FIG. 2A, the stiffener member(62) is attached to a perimeter region of the organic laminate chipcarrier (31) with a layer of adhesive material (61) and the planarpackage lid (64) is attached to the stiffener member (62) with a layerof adhesive material (63). As depicted in FIG. 2B, the stiffener member(62) has a rectangular frame-like structure with an outer border (62 a)and inner border (62 b). The outer border (62 a) has a rectangular shapethat corresponds to the outer perimeter of the chip carrier substrateand the inner border (62 b) has a rectangular shape that defines aninner open region which aligns to the inner surface region of thecarrier substrate (31) in the area occupied by the chips (32) andsurrounding devices (37).

As compared to the conventional package structure (10) of FIGS. 1A/1B,the conventional package structure (11) of FIGS. 2A and 2B can beconstructed in a process by which the stiffener member (62) is attachedto the organic carrier (31) prior to the chip mounting process, whichreduces possible warping of the substrate (31) and maintains theflatness of the substrate (31) before the chip (32) is attached to thechip carrier substrate (31), and further provides the requisitemechanical support during a solder reflow process when the chip (32) ismounted to the chip carrier (31). The types of adhesive used to formlayers (61) and (63) will vary depending on the desired mechanicalproperties.

In this conventional framework, the SCM chip package (60) would beattached to the circuit board (20) by a solder reflow process if BGA orCGA electrical interconnects are used, or plugged into a socket if PGAelectrical interconnects are used, or aligned to an LGA connector if LGAelectrical interconnects are used. A second TIM layer (45) would than bedispensed onto the lid (33), or the bottom of the cooler device (40),and they would be joined and the cooler device (40) secured to thecircuit board (20) by the attachment devices (50). As described above,it would be desirable to use a TIM2 (45) material which is reworkableand does not require curing at an elevated temperature.

FIG. 3 schematically illustrates another embodiment of an electronicmodule having a conventional framework for packaging a single chipmodule (SCM) with a cooling module onto a circuit board (20). Inparticular, FIG. 3 is a schematic side view of an electronic module (12)including a printed circuit board (PCB) (20) (or node card, printedwiring board, or printed circuit card), a 1^(st) level chip package (70)and cooler device (40) in a stacked configuration with the chip package(70) interposed between the circuit board (20) and the cooler device(40). The cooler (40) is mechanically attached to the circuit board (20)using an attachment device (50). Except for the first level chip package(70), the electronic module (12) illustrated in FIG. 3 has aconventional framework with similar components of the electronic modules(10) and (11) discussed above, and therefore, a detailed explanation isnot required.

With the electronic module (12) of FIG. 3, the chip level package (70)includes a rectangular shaped stiffener member (72) that is attached toa perimeter region of the organic laminate chip carrier (31) with alayer of adhesive material (71), but the chip level package (70) doesnot include a package lid structure (as compared to the chip package(30) with package lid (33) and the chip package (60) with package lid(64)). The electronic module (12) is a lidless SCM structure in whichthe stiffener member (72) may have a structure similar to the stiffenermember (62) depicted in FIG. 2B, but the thickness of the stiffenermember (72) can be varied to obtain a given stiffness. In theconventional embodiment of FIG. 3, a heat spreading function is achievedby thermally bonding the backside of the chip (32) directly to thebottom surface of the cooler device (40) using a mechanically compliant,thermal interface layer (TIM) (73).

The conventional package structure (12) of FIG. 3 provides a lowerthermal resistance thermal path between the backside of the chip (32)and cooler (40), as compared to the conventional lidded SCM packagestructures (10) and (11) in which lid structures are disposed in thethermal path between the chip (32) and cooling device (40). Indeed, alower thermal resistance path is achieved by eliminating the thermalresistance of a package lid between the chip (32) and cooler (40) andthe thermal resistance that exists due to the TIM2 layer (45) betweenthe package lid and cooler (40). Indeed, in FIG. 3, the thermalresistance in the path between the chip (32) and cooler (40) is based onthe thickness and material used to form the TIM layer (73). Although alidless chip package structure (12) of FIG. 3 can theoretically provideincreased thermal performance, the ability to actually achieve a lowthermal resistance TIM layer (73) between the chip (32) and cooler (40)in the framework of FIG. 3 is problematic by virtue of the increasedmechanical complexity of having the cooler (40) attached to the circuitboard (20) and the chip (32) attached to the laminate carrier (31) whichis attached to the board (20).

More specifically, in the framework of FIG. 3, the cooler (40) ismechanically attached to the circuit board (20) using the attachmentdevice (50), which would typically apply a compressive load to hold thecooler (40) in a fixed position against the backside surface of the chip(32) With this framework, it is important to obtain and maintain therequisite bond line (i.e., desired uniform thickness of TIM (73) betweenthe chip (32) and cooler (40). Thus, when the cooler (40) is beingmounted, it is important to ensure that the cooler (40) is maintainedflat against the back surface of the chip (32), and that excessive forceis not applied to the chip (32), and that the chip (32) is protectedagainst excessive forces from shock or vibration so as to obtain andmaintain the requisite bond line of TIM layer (73). The TIM layer (73)would typically consist of a filled paste or grease, as it isundesirable to use a filled adhesive or gel materials which wouldrequire curing at 100-150° C. and which are not easily reworkable.However, the disadvantage of using a paste or grease is its tendency topump out from the space between the backside of the chip (32) and thecooler (40) as a result of thermal excursions where chip warpages varydue to the mechanical complexity of having the cooler (40) attached tothe board (20) and the chip (32) attached to the laminate carrier (31)which is attached to the board (20).

In this conventional framework, the SCM chip package (70) would beattached to the circuit board (20) by a solder reflow process if BGA orCGA electrical interconnects are used, or plugged into a socket if PGAelectrical interconnects are used, or aligned to an LGA connector if LGAelectrical interconnects are used. A TIM layer (73) would then bedispensed onto the back side of the chip (32), or the bottom of thecooler device (40), and they would be joined and the cooler device (40)secured to the circuit board (20) by the attachment devices (50). Asdescribed above, it would be desirable to use a TIM (73) material whichis reworkable and does not require curing at an elevated temperature.

State of the art chip packaging technologies typically utilize metallicmaterial such as copper to construct chip package cooler devices (e.g.,liquid coolers) or heat sink structures because copper has a very highthermal conductivity, and can be readily machined/etched/formed intofine features and dimensions (e.g., micro channel cooler devices) withlow manufacturing costs. Typically, copper liquid cooler devices areused for cooling chips mounted on ceramic multichip modules (MCMs).However, in each of the conventional frameworks discussed above, thecooler (40) is physically attached to the circuit board (20), thefootprint of the cooler (40) must be larger than the footprint of thechip (32) and extend past the outer periphery of the chip (32) so as toconnect to the board (20). This large size metallic cooler posedpractical limitations such as follows:

When a BGA (ball grid array) or CGA (column grid array) attachmenttechniques are used to mechanically/electrically connect the carrier(31) to the circuit board (20), a large size metallic cooler (40)results in a large thermal mass that is not compatible with the BGA orCGA reflow process. Moreover, the resulting weight of the SCM module maybe too high preventing the module from self-aligning to the printedcircuit board pads and can compress the liquid solder excessivelythereby causing shorts during the solder reflow process. Therefore, witha BGA or CGA electrical interconnect to the circuit board (20) a largesize metallic cooler may need to be attached to the SCM chip packageafter the reflow process used to attach the SCM chip package to thecircuit board. For other mechanical area array connection methods suchas LGA (land grid array) or a pin grid array (PGA), where a compressiveforce must be applied for actuation, such compressive forces may resultin a thin and/or non uniform thickness of the TIM layer between theliquid cooler and chip.

In this regard, when designing chip packages, various factors must beconsidered, such as carrier structure, types of package materials andunderfill used, the fabrication process flow, chip size, thermalproperties, etc., to minimize or prevent package defect mechanisms andstructural failures as a result of strains and stresses that may arisefrom thermal cycling during production, joining processing, and use.

BRIEF SUMMARY

Exemplary embodiments of the invention generally include semiconductorpackage structures having liquid coolers integrally packaged with firstlevel chip modules and, more specifically, apparatus and methods forintegrally packaging a liquid cooler device within a first level chippackage structure wherein the liquid cooler device is thermally coupleddirectly to the back side of an integrated circuit chip flip-chipmounted on flexible chip carrier substrate, and wherein the liquidcooler device is mechanically coupled to the package substrate through ametallic stiffener structure that is bonded to the flexible packagesubstrate to provide mechanical rigidity to the flexible packagesubstrate. Exemplary embodiments of the invention include a variety ofstructures for integrating a metallic liquid cooling device with ametallic stiffener and/or lid for a high power IC chip mounted activeside down on an organic carrier to form first level package structuresthat can be subsequently attached to a printed wiring board using anarray of solder balls, an array of solder columns, a land grid array, ora pin grid array.

For example, in one exemplary embodiment of the invention, a metalliccooler device is integrated into a first level chip package module usinga metallic stiffener member having a planar frame portion that isadhesively bonded to an outer peripheral region of the first surface ofthe carrier substrate, and extension tabs that extend from the planarframe portion towards the metallic cooler, wherein the extension tabsare coupled to the metallic cooler device to provide a mechanicalattachment for the metallic cooler device. The stiffener extensionsprovide a mechanical attachment for the cooler and/or a controlledcompressive force between the cooler and the chip mounted on thecarrier.

In other exemplary embodiments of the invention, metallic coolers aredesigned with extensions that overlap and are adhesively attached to astiffener or extensions which are adhesively attached directly to thetop surface of the organic carrier. In other exemplary embodiments, theedges of the cooler are joined to an opening which is formed in thepackage lid where the lid is either attached to a stiffener which isattached to the carrier, or the lid is attached directly to the carrier.In a preferred embodiment, the active region of the cooler is smallerthan the area of the chip, but including the seal regions and manifoldregions, the cooler is equal in size, or extends beyond the chip.

These and other exemplary embodiments, aspects, features, and advantagesof the present invention will become apparent from the followingdetailed description of exemplary embodiments, which is to be read inconnection with the accompanying drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIGS. 1A and 1B schematically illustrate an embodiment of an electronicmodule having a conventional framework for packaging a single chipmodule (SCM) with a liquid cooling device.

FIGS. 2A and 2B schematically illustrate another embodiment of anelectronic module having a conventional framework for packaging a singlechip module (SCM) with a cooling device.

FIG. 3 schematically illustrates another embodiment of an electronicmodule having a conventional framework for packaging a single chipmodule (SCM) with a cooling device.

FIGS. 4A and 4B schematically illustrate an electronic module having achip level package structure with an integrated cooler, according to anexemplary embodiment of the invention.

FIG. 5 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIG. 6 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIG. 7 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIG. 8 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIG. 9 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIGS. 10A and 10B schematically illustrate an electronic module having achip level package structure with an integrated cooler, according toanother exemplary embodiment of the invention.

FIG. 11 schematically illustrates an electronic module having a chiplevel package structure with an integrated cooler, according to anotherexemplary embodiment of the invention.

FIGS. 12A and 12B schematically illustrate an exemplary embodiment of ametallic cooler device that may be implemented in any of exemplaryembodiments of the invention.

FIG. 13 schematically illustrates an exemplary cooler device that isthermally bonded to the backside of the chip using a TIM layer where thecooler is sized such that the cooler width is similar to the width ofthe chip and where the sides of the cooler do not extend past the sidesof the chip, according to an exemplary embodiment of the invention.

FIG. 14 schematically illustrates an exemplary cooler device that isthermally bonded to the backside of the chip using a TIM layer where thecooler is sized such that the cooler width is larger than the width ofthe chip at least in one dimension, according to an exemplary embodimentof the invention.

FIGS. 15A˜15D are exemplary graphical diagrams that illustrate resultsof thermal modeling with respect to total thermal resistance (Rtotal)versus active cooler width WAA (in mm) for various seal band widths withdifferent fixed base thickness values.

DETAILED DESCRIPTION

Various techniques for constructing electronic modules having chip levelpackage structures with integrally packaged metallic liquid coolingdevices will now be described in further detail with reference toexemplary embodiments discussed hereafter. In general, electronicapparatus according to exemplary embodiments of the invention includesemiconductor chip modules, such as SCMs, having an IC chip flip chipmounted on a first (top side) surface of a flexible carrier substratehaving an area array of electrical contacts formed on a second (bottomside) surface of the substrate opposite the first surface, a metalliccooler thermally coupled directly to a backside surface of the IC chipand a stiffener member which is (i) bonded to the first surface of thecarrier substrate to provide mechanical rigidity to the carriersubstrate, as well as (ii) mechanically coupled to the metallic coolerto fixedly dispose the metallic cooler device in place on the backsideof the IC chip.

The maturity of organic laminate substrate technology has rapidlyincreased while the unit cost has decreased, and it is now the preferred1^(st) level packaging technology for high performance chip carriers. Atypical organic carrier substrate consists of multiple core layers,typically with sequentially built up fine-pitch wiring layers on top andbottom surfaces, with a total thickness of about 0.8 mm or less. In thefuture, to support finer via pitches and line widths, the totalthickness will be reduced to 0.5 mm and perhaps even to 0.3 mm. Thisreduction in thickness will greatly reduce the stiffness and mechanicalstrength of the organic carrier substrate, resulting in them being evenmore flexible. Exemplary embodiments of the invention as discussedherein below allow for integration of metallic liquid cooler devices infirst level chip packages where chips are mounted face down on thinorganic substrates.

FIGS. 4A and 4B schematically illustrate an electronic module having achip level package structure with an integrated cooler, according to anexemplary embodiment of the invention. In particular, FIGS. 4A and 4Bare schematic views of an electronic module (100) comprising a circuitboard (110) (e.g., PCB, node card, printed wiring board, printed circuitcard, etc,) and a chip package structure (120) mounted on the circuitboard (110). FIG. 4A is a schematic side view of the electronic module(100) taken along line 4A-4A in FIG. 4B, and FIG. 4B is a top plan viewof the electronic module (100) along line 4B-4B in FIG. 4A. As shown in

FIG. 4A, the chip package structure (120) may be a first level chippackage structure comprising a first level chip carrier (121) (packagesubstrate), an IC (integrated circuit) chip (122), a cooler device (123)stacked on the backside of the IC chip (122) and a metallic stiffenermember (130). In general, the package substrate (121) is a flexiblesubstrate, such as a polymer substrate or organic build-up laminatesubstrate, etc., which is electrically and mechanically coupled to thethe circuit board (110) using an area array of electrical contacts (124)such as BGA electrical contacts, although other area array connectiontechniques may be used to mechanically and electrically couple the chippackage structure (120) to the circuit board (110), such as CGA, PGA orLGA connections. The circuit board (110) comprises various levels ofwiring (111) and a plurality of plated through holes (112) that areelectrically connected to the contacts (124).

The IC chip (122) is flip-chip mounted to the top surface of the chipcarrier (121) using an area array of C4 solder ball connections (125)and an underfill material (126) (e.g., epoxy) that encapsulates the C4contacts (125) and bonds the chip (122) to the carrier (121). Themetallic liquid cooling module (123) (or cooling apparatus) is thermallycoupled directly to the non-active surface of the IC chip (122) using aTIM1 layer (127) and fixedly disposed on the non-active surface of theIC chip (122) using a stiffener member (130). As explained hereafter,the stiffener member (130) serves a dual function of providingmechanical rigidity to the flexible substrate (121) and mechanicallycoupling the cooler device (123) to fixedly hold or otherwise clamp thecooler device (123) in place on the backside of the chip (122) forpurposes of integrating the cooler (123) into the 1^(st) level chippackage.

As illustrated in FIGS. 4A and 4B, the stiffener member (130) comprisesa planar frame portion (131) and a plurality of extended portions (132)(alternatively referred to as “extension tabs”). The planar frameportion (131) is an outer frame structure that is bonded to theperipheral surface region of the substrate (121) via a layer of adhesive(133) (e.g., a flexible adhesive material such as 3M 1509 or a muchstiffer adhesive such as Pyralux). The extension tabs (132) extend fromthe frame portion (131) and have bent end portions (132 a) that arebonded to the sidewalls of the cooler (123) with a layer of adhesive(134) or joining material such as a solder. As readily illustrated inFIG. 4B, the frame portion (131) of the metallic stiffener member (130)comprises a continuous, planar rectangular-shaped frame structure withan outer border (131 a) and an inner border (131 b), which is sized andshaped to bond to the peripheral surface region of the chip carrier(121). The outer border (131 a) has a rectangular shape that correspondsto the outer perimeter of the chip carrier substrate (121) and the innerborder (131 b) has a rectangular shape that defines an inner open regionwhich aligns to the inner surface region of the carrier substrate (121)in the area occupied by the chip (122) and surrounding devices (128).The extension tabs (132) are arranged on each side of the cooler device(123) and extend from each side of the inner rectangular border (131 b)of the planar frame (131) with the extension tabs (132) bonded to thesidewalls of the cooler (123). The cooler device (123) includes coolantfluid inlet and outlet ports P1, P2 on the top surface of the cooler(123).

In the exemplary embodiment of FIG. 4B, the stiffener extension tabs(132) are not continuous but have openings aligned to and exposingregions of the substrate (121) on which decoupling capacitors (128) aremounted. In particular, in FIG. 4B, the extension tabs (130) on eachside of the cooler (123) include three separate tabs that are commonlyconnected at the ends thereof, i.e., one end of the tabs are commonlyconnected to the planar frame portion (131) and other ends of the tabsare connected to a single bent end portion (132 a) which is coupled tothe sidewall of the cooler device (123). In another embodiment, eachextension tab (132) that extends from the inner border (131 b) on eachside of the cooler (123) may be one continuous tab structure thatextends over the top of any decoupling capacitors (128) or othercomponents, with no openings.

It is to be appreciated that extension tabs (132) can be fabricated aspart of the stiffener (130) and integrally formed with the frame portion(131). The stiffener member (130) with extension tabs (132) can beformed from stamping a thin planar metallic material such as copper oraluminum to form a planar metallic pattern of the frame and tabs,followed by a secondary operation to physically bend portions of theresulting stiffener into a desired shape, or the modified stiffenercould perhaps be fabricated in a single stamping or coining operation.It is to be appreciated that stiffener structures with extension tabscan be designed with varying shapes and dimensions to provide varyingdegrees of mechanical coupling and stiffness between the portion of thestiffener attached to the perimeter of the carrier and the coolermounted over the chip to flatten the carrier, reduce the stress in thechip due to the thermal expansion mismatch between the carrier and chip,and improve the reliability by reducing the total flexure during thermalcycling. For example, the stiffener extension tabs can be formed withridges, bends, and/or creases to achieve certain mechanical propertiesthat provide necessary mechanical forces for fixedly maintaining thecooler device in position on the backside surface of the chip.

In FIG. 4A, the stiffener member (130) has extension tabs (132) that aredesigned to fixedly clamp the cooler (123) in position over the backsideof the chip (122). In other exemplary embodiments of the invention, theextension tabs (132) can be shaped to not only fixedly clamp the cooler(123) in position over the backside of the chip (122), but also shapedto be in tension to apply a downward force to hold the cooler (123)against the back surface of the chip (121). For example, FIGS. 5 and 6schematically illustrate electronic modules having chip level packageswith integrated cooler modules according to other exemplary embodimentsof the invention. In particular, FIGS. 5 and 6 are schematic side viewsof respective electronic modules (101) and (102) that are similar indesign to the electronic module (100) of FIG. 4A except for differencesin shapes and configurations of stiffener members.

In FIG. 5, a stiffener member (130′) includes a planar frame portion(131) and extension tabs (132) that are shaped to not only fixedly clampthe cooler (123) in position over the backside of the chip (122), butalso shaped to be in tension to apply a downward force to hold thecooler (123) against the back surface of the chip (122) in FIG. 5, theextension tab (132) includes a plurality of bent portions (132 a), (132b) and (132 c), with the end portion (132 a) fixedly bonded to thesidewalls of the cooler (123). In this framework, the bent portions (132b) and (132 c) are bent/shaped relative to each other or otherwiseshaped to be in tension when assembled such that the tension applies adownward force on the cooler (123).

Furthermore, FIG. 6 illustrates a stiffener member (130″) having aplanar frame portion (131) and extension tabs (132) having portions (132d) and (132 e), where the end portions (132 d) extends over the edge ofthe upper surface of the cooler (123). The portions (132 d) and (132 e)are bent relative to each other or otherwise shaped to be in tensionwhen assembled such that end portion (132 d) applies a downward force ontop surface of the cooler (123).

In the exemplary embodiments of FIGS. 4A, 5 and 6, the TIM layer (127)between the cooler (123) and the chip (122) may be a compliant filledadhesive or gel, or a soft solder layer such as Indium, though othertypes of TIMs could also be used. Preferably, a compliant thermaladhesive material or a soft solder material is used to form the TIM1layer (127) when there is a CTE mismatch between the materials of thechip (122) (e.g., silicon) and the metallic cooler (123) (e.g., copper)so as to maintain the integrity of the thermal bond and counteractmechanical stresses that may arise due to differential thermal expansionof the chip and cooler surfaces. If the TIM1 layer (127) is formed of alow strength material, or a if a gel-type TIM is used, the stiffenerextension tabs (132) can be sized and shaped to not only fixedly holdthe cooler (123) in position over the backside of the chip (122), but toalso apply a downward, compressive force to the cooler (123) whenassembled to the cooler (123), which clamps the cooler (123) downagainst the backside surface of the chip (122). This clamping force canprevent any large tensile force being applied across the TIM1 layer(127) due to shock or vibration, which could tear or separate the TIMlayer (127) from the surfaces to which it is bonded. This could beaccomplished, for example, by applying an appropriate weight to the topsurface of the cooler (123) when it is being attached to the stiffenerextensions (132) and the adhesive materials are being cured. Theexemplary package structures (100), (101) and (102) provide the highthermal performance advantages of a lidless package (such as in FIG. 3)i.e. only a single TIM layer (127) is provided in the thermal pathbetween the chip (122) and the cooler (123). Although no lid is used,the chip is still protected by the copper cooler (123). Further, alower, and more repeatable, thermal resistance is achieved with the TIM1layer (127) when adhesive TIM materials are used, the assembly processcan be better controlled, and bond line between the chip and cooler canbe reduced when the cooler is integrated into the first level package.Moreover, no attachment holes are required in the mother board (110).Further, the exemplary package structures (100), (101) and (102) allowfor uniformity of load distribution when LGA type connectors are used toconnect the module (120) to the board (110). With an LGA connector, itis necessary to provide a uniform load to actuate the LGA across thebottom surface of the package. The stiffener extensions (130, 130′,130″) serve to couple the lid and stiffener together, which makes iteasier to provide such a uniform actuation force. This is difficult toachieve with a lidless package such as is shown in FIG. 3, as notedabove.

Another advantage of the exemplary embodiments is that a smallermetallic cooler can be used so the weight of the overall assembly isminimized and the cooler size need not be any larger than is required toeffectively cool the chip. As noted above, the low weight is importantfor BGA assembly, along with shock and vibration resistance and it isdesirable to minimize the cooler size as the fabrication cost of coolersoften scale with their size and is significantly greater than that ofstiffener, or lids. It is to be further appreciated that the metallicstiffener with extensions and cooler (123) function together to providemechanical rigidity to the flexible organic laminate chip carrier (121).

A number of assembly processes are possible, where it is contemplatedthat in all cases that the cooler would be attached to the 1^(st) levelpackage assembly before it is attached to a mother board or node card.Such a sequence is highly desirable as it allows an adhesive TIM (127)to be cured without subjecting the mother board (110) to the additionalprocessing step and also due to logistical and yield issues. For thestructures illustrated in FIGS. 4 and 5, the cooler (123) could beattached after the chip (122) and stiffener (130) are attached to thecarrier (121). For the structure in FIG. 6, the cooler (123) andstiffener (130″) would need to be attached to the carrier and chip afterthe chip was attached to the carrier.

In other exemplary embodiments of the invention, the metallic coolerdevice can be mechanically coupled to the substrate carrier usingextension members that are integrally formed as part of the coolermodule, which are bonded to a separate stiffener member on the substrateor directly to the substrate. For example, FIGS. 7, 8 and 9 areschematic cross section views of electronic modules having metalliccoolers with integrally formed extension elements that are used tomechanically couple the cooler to the package. FIG. 7 schematicallyillustrates an electronic module having a chip level package with anintegrated cooler module according to an exemplary embodiment of theinvention. In particular, FIG. 7 is a schematic view of an electronicmodule (200) comprising a circuit board (110) (or node card, printedwiring board, or printed circuit card, etc,) and a chip packagestructure (220) mounted on the circuit board (110). The module (200) issimilar in structure to previously discussed embodiments, except thatthe chip package structure (220) includes a metallic liquid coolingmodule (223) (or cooling apparatus or device) having integrally formedextensions (240) which are coupled to a stiffener member (230). Thestiffener member (230) is a planar frame structure that is bonded to aperipheral surface region of the substrate (121) using a layer ofadhesive material (233). The cooler extensions (240) extend from thebottom sidewall surfaces of the cooler (223) and are bonded to thestiffener member (230) using a layer of adhesive material (234). In theexemplary embodiment of FIG. 7, the stiffener (230) can be sized andshaped to provide sufficient bonding and rigidity to the substrate (121)and the cooler extensions (240) can be sized and shaped to provideadequate overlap of the stiffener member (230) to adhesively bond thecooler extensions sufficiently to the stiffener member (230).

FIG. 8 illustrates an electronic module (201) according to anotherexemplary embodiment of the invention which is similar to the module(200) of FIG. 7, except that the stiffener member (230′) is smaller andthe cooler (223) includes longer extensions (241) that extend from thebottom sidewall surfaces of the cooler (223) to the edges of thestiffener (230′) and carrier (121). In this exemplary embodiment, thesmaller footprint of the stiffener (230′) provides more surface area onthe substrate (121) to mount components (128) next to the chip (122),while ensuring that the overlap between the cooler extensions (241) andthe stiffener member (230′) is sufficient to adequately bond the coolerand stiffener.

FIG. 9 illustrates an electronic module (202) according to anotherexemplary embodiment of the invention which is similar to the exemplaryembodiment of FIGS. 7 and 8, except that the metallic cooler (223)includes extensions (242) that are directly bonded to the peripheralsurface region of the substrate (121). In particular, in FIG. 9, theextensions (242) are not bonded to separately formed and mountedstiffener member (as in FIGS. 7 and 8), rather, the extensions (242) aredesigned to have protruding peripheral rim portion (242 a) on a bottomsurface thereof, which is directly bonded to the substrate (121) using alayer of adhesive material (233).

In the exemplary embodiments of FIGS. 7, 8 and 9, the cooler extensionscan be designed as continuous solid members (e.g., solid plate) thatextend from the bottom surface of the cooler (223) that thermally bondsto the backside of the chip (122). In other exemplary embodiments, theextensions can be formed with apertures (similar in concept to theapertures of the stiffener extension tabs of FIG. 4B) as desired toreduce the amount of stress that would be imparted to the organiccarrier substrate (121) and the chip (122). The portions of the coolerextensions adjacent the cooler (223) could have a thickness in the rangeof 0.5 to 2 mm if it is continuous and solid between the cooler (223)and where the extensions overlap the stiffener or reach the edge of thecarrier. The embodiment shown in FIGS. 7, 8 and 9 would allow the use ofan LGA connector as the cooler extensions would couple a load from thecooler into the stiffener, or directly into the organic carrier (121)and would be light enough for BGA reflow.

In other exemplary embodiments of the invention, a metallic coolerdevice can be mechanically coupled to a first level chip packagesubstrate by bonding the sidewalls of a cooler to edges of an openingwhich is formed in a package lid, where the lid is either attached to astiffener which is attached to the carrier, or where the lid is attacheddirectly to the carrier, such as illustrated in the exemplaryembodiments of FIGS. 10A/10B and 11. In particular, FIGS. 10A and 10Bare schematic views of an electronic module (300) comprising a circuitboard (110) (e.g., PCB, node card, printed wiring board, printed circuitcard, etc,) and a chip package structure (320) mounted on the circuitboard (110). FIG. 10A is a schematic side view of the electronic module(300) and FIG. 10B is a top plan view of the electronic module (300)along line 10B-10B in FIG. 10A. The electronic module (300) is similarin structure to previously discussed embodiments, except that the chippackage structure (320) includes a planar package lid (340) having anaperture formed in a central region thereof, wherein the metallic liquidcooling module (123) is disposed in the aperture formed in the planarpackage lid (340). The edges of the metallic cooler are joined to anopening which is formed in a central region of the package lid (340) andwhere the lid (340) is adhesively attached to a stiffener member (330).The cooler device (123) is bonded to the inner edges of the lid apertureusing a bond material (335), the package lid (340) is adhesively bondedto the stiffener member (330) via a layer of adhesive (334) and thestiffener (330) is bonded to the peripheral surface region of thesubstrate (121) with a layer of adhesive material (333). In FIG. 10A, anexcess material of the TIM (127) between the chip (122) and the cooler(123) can be used to form a bridging bond (129) in the gap between thecooler/lid edge and the carrier surface (121) or underfill (126)adjacent to the sides of the chip (122). If an adhesive material is usedfor the TIM (127), the bridging bond (129) between the cooler/lid andthe surface of the carrier in the region near the chip provides furthermeans to prevent chip warpage. It is to be understood that the bridgingbond (129) can be implemented in other exemplary embodiments describedabove.

FIG. 10B is a schematic top view of the package shown in FIG. 10A,including the fluid inlet and outlet ports (P1 and P2). The join betweenthe cooler and the lid is also indicated. As with previous embodiments,the attachment between the cooler and the lid would couple them togetherand enable the use of an LGA connector.

FIG. 11 is a cross-sectional view of an electronic module (301)according to another exemplary embodiment of the invention, which issimilar to the embodiment of FIG. 10A, except that the package lid (340)includes a peripheral rim portion (341 a) that is formed on a peripheralbottom surface of the lid (340), which is directly bonded to theperipheral surface region of the substrate (121) using adhesion layer(333). Note that the lid serves to flatten and increase the stiffness ofthe laminate carrier when no stiffener is used. FIG. 11 differs fromFIG. 10 in that the separate stiffener member (330) in FIG. 10 iseliminated.

In the exemplary embodiments of FIGS. 10 and 11, the package lid (340)can be formed of copper by stamping, coining or machining a bulk blockof copper, wherein the lid aperture can be readily fabricated by thesemethods. The thickness of the lid may be 0.5 to 2.0 mm thick. The copperlids can be plated with nickel, or nickel and gold. The package lid(340) and the cooler (123) may be bonded using a layer of bond material(335), which can be solder, or a suitable adhesive material that couldvary between a low modulus, flexible adhesive to a high strengthstructural adhesive to control the mechanical interaction of the coolingstructure with various chip/substrate structures. The cooler size isminimized and the cooler (123) does not need to be any larger than isrequired to effectively cool the chip.

The exemplary package structures of FIGS. 10 and 11 can be assembledvarious ways. The cooler (123) and lid (340) could be assembled to thecarrier (121) and chip (122) by either lid first, cooler first, or bothat the same time after joining them together, or both at the same timeand joined them together at the same time or later. In one preferredprocess, the cooler (123) and lid (340) may be joined as a subassembly,and then attached to the chip (122) and carrier (121) to minimizehandling of individual parts during module assembly processing.

FIGS. 12A and 12B schematically illustrate a metallic liquid coolerdevice according to an exemplary embodiment of the invention. FIGS. 12Aand 12B illustrate an exemplary framework of a metallic liquid coolerdevice (400) that may be implemented as the liquid cooler devices (123)and (223) shown in the exemplary package structures described above.FIG. 12A is a schematic cross sectional view of a metallic cooler device(400) taken along line 12A-12A in FIG. 12B and FIG. 12B is a schematictop plan view of the metallic cooler device (400) from the perspectiveof line 12B-12B in FIG. 12A.

In general, the liquid cooler device (400) includes a cooler body (404)comprising a plurality of thermal fins (401) and flow channels (402),and a cover plate (403). It is to be understood that otherconfigurations of thermal fins and flow channels can be used such asmesh structures or staggered stacked microchannels as described in U.S.application Ser. No. 12/120,069, filed May 13, 2008, which is commonlyassigned and incorporated herein by reference. The cover plate (403) isbonded to the top surface of the body (404) and the tops of the fins(401) thereby defining a chamber for the flow of a coolant (e.g., water)through the channels (402) between the inlet and outlet manifolds M1,M2. Heat removal is achieved by thermal contact between the fins (401)and the coolant fluid that flows through the channels (402). As shown inFIG. 12B, the thermal fins (401) include a plurality of elongated,parallel thermal fins that may be formed by etching/machining a block ofmetallic material (e.g., copper) to form the cooler body (404) flowchannels (402) and tapered manifold channels (M1) and (M2). In theexemplary embodiment, the manifold channel Ml is a coolant supplymanifold and the manifold channel M2 is a coolant return manifold,arranged on opposite ends of the flow channels (402). Further, thedotted circles P1 and P2 represent where respective input and outputports would be made in the cover plate (403) to provide the fluidsupply/return connections.

The input manifold M1 and output manifold M2 are formed with taperedcross section channels to maintain the velocity of the fluid flow nearconstant and reduce dynamic pressure drop. For instance, thecross-sectional area of the flow channel of the supply manifold (M1)that is aligned with the inlet port (P1) is tapered to provide uniformdistribution of coolant fluid to the input ends of the flow channels(402) fed by coolant fluid from the input manifold M1. Moreover, thecross-sectional area of the flow channel of the return manifold (M2)that is aligned with the output port (P2) is tapered to provide uniformredistribution of the output coolant fluid that flows out from the endsof each flow channel (402) into the output manifold M2. In suchframework, the area of the flow channels of the manifolds are taperedsufficiently to reduce the dynamic pressure drop by maintaining thevelocity of the coolant fluid substantially, or very close to, constantamong the flow channels (402) in the metallic cooler device (400).

FIGS. 12A and 12B further illustrate that the outer perimeter walls ofthe cooler device (400) have a perimeter seal surface area (or sealband), of at least width W_(P) around the outside perimeter of thecooler. The perimeter seal width W_(P) is typically in the range of 0.2to 2.0 mm, to provide sufficient bonding area for bonding the coverplate (403) to the cooler body (404). An active cooling area of thecooler (400) is illustrated in FIG. 12B as a region with area ofL_(AA)×W_(AA) which includes the alternating thermal fins (401) and flowchannels (402) (or other microstructures which have a reduced hydraulicdiameter and increased cooler surface area). The perimeter seal areasW_(P) and manifold regions M1, M2 are not considered to be part of theactive cooling area of the cooler (400). The cooler (400) has a basethickness (T_(B)), typically in the range of 0.3 to 2.4 mm, of solidmaterial under the active cooling area L_(AA)×W_(AA), as indicated inFIG. 12A.

When constructing chip package structures with integrated metalliccoolers according to exemplary embodiments of the invention as describedherein, it is preferable to minimize the size of metallic cooler devicewhile achieving sufficient cooling performance. For instance, withregard to cooler weight, if a BGA attachment to the board is used, it isdesirable to minimize the total weight of the 1^(st) level packageassembly. For a 50×50 mm carrier, increasing the Cu lid thickness from 2mm to 3 mm was found to result in an increase in shorting between theBGA balls unless a modified join process with tighter process controlswas used. Copper has a density of about 8.96 grams per cubic centimeter,so a 3 mm thick Cu lid corresponds to a weight of about 2.7 grams persquare centimeter of carrier area. Therefore, an exemplary factor toconsider when designing package structures is that the weight of thepackage lid, cooler, and stiffener should be less than the weight of a 3mm thick Cu layer equal in dimensions to the carrier size, i.e. lessthan 2.7 grams per square cm of carrier area. The weight scales with thecarrier size as proportionately more solder balls are used on a largercarrier.

Further, various factors may be considered when constructing metalliccooler devices that are thermally bonded directly to the backside offlip chip mounted chips on a flexible substrate so that the activeregion of the cooler is smaller than the area of the chip, but includingthe seal regions and manifold regions, the cooler is equal in size, orextends beyond the chip. With current 200 mm and 300 mm diameter siliconwafers, unless thinned, the resulting integrated circuit chips are about0.7 to 0.8 mm thick. For a typical chip, the footprint of the active(powered) area extends to within about 0.1 mm to 0.2 mm from thephysical edge of the chip. Given the thickness of the chip and the smalldistance from the active powered area to the chip edge, heat will spreadover the entire chip area. In this regard, the entire chip may beconsidered to be powered and just the diced chip size considered, aslong as the entire chip is in thermal contact with the cooler. As willbe explained below, in one exemplary preferred embodiment of theinvention, when a manifold region is not present between the active areaand the perimeter seal band, the preferred configuration is for thecooler active area to be somewhat smaller than the chip size and for theperimeter seal to extend beyond the end of the chip.

For instance, FIG. 13 illustrates an exemplary cooler device (400′) thatis thermally bonded to the backside of the chip (122) using thermal TIMlayer (127) (as discussed above). In FIG. 13, the cooler (400′) is sizedsuch that the cooler width is similar to the width Wc of the chip (122)where the sides of the cooler (400) do not extend past the sides of thechip (122). FIG. 14 illustrates an exemplary cooler device (400″) thatis thermally bonded to the backside of the chip (122) using thermal TIMlayer (127) (as discussed above), where the cooler (400″) is sized suchthat the cooler width is greater than the width Wc of the chip (122)where the sides of the cooler (400″) extend past the sides of the chip(122). The active area of the cooler (400′) in FIG. 13 is smaller thanthe active area of the cooler (400″) of FIG. 14 at least with regard tothe difference in the widths W_(AA) of the respective active areas.However, as will be shown below, the reduced active area (in FIG. 13)has little or no effect on the thermal performance. Given that thefabrication cost of a cooler is greater per unit area than that of alid, stiffener extensions, etc . . . , it is desirable to minimize thecooler size, and hence active area.

Thermal modeling was performed using commercially available software todetermine optimum and minimum practical sizes for the “active coolerarea” of a metallic cooler with a fixed coolant flow. In one process, amodel of a package structure was defined with a silicon chip thermallybonded to a copper cooler device using a thin TIM layer. In the model,the silicon chip was defined to have a fixed size (area) of 22×22 mm,and a thickness of 0.785 mm. The TIM layer was defined to have a thermalconductivity of 3.8 W/m-K and a thickness of 2 mil. An effective heattransfer coefficient, determined assuming constant total liquid flow,was applied on the cooler active area along the cooler base and top, andthe effects of the water temperature rise were considered. It wasassumed that the fluid inlet was along a line dividing the chip in half,the outlets were parallel and at the edges of the active cooler area,and that the inlet and outlet regions did not displace any fins. Thecooler base thickness, active area size, and perimeter seal width werevaried. It was assumed that the cooler was fabricated from copper andthat the sides of the cooler, i.e. the width of the perimeter seal,extended to a cooler top surface which had a thickness equal to thecooler base thickness and the cooler top was attached to the activecooling structure as was the cooler base. The total thermal resistancewas calculated by dividing the difference between the maximumtemperature on the active side of the chip and the inlet watertemperature by the total power. A uniform power distribution across thechip, and a square cooler with a uniform seal width on all sides wasassumed with no manifold regions. In the modeling, it was also assumedthat the cooler base was flat and coplanar under both the active cooledregion and the seal regions.

FIGS. 15A˜15D are exemplary graphical diagrams that illustrate resultsof thermal modeling based on the above mentioned parameters. Inparticular, FIGS. 15A, 15B, 15C and 15D graphically illustrate a totalthermal resistance (Rtotal) versus active cooler width W_(AA) (in mm)for coolers with seal band widths Wp of 0.2, 0.5, 1.0 and 2.0 mm withfixed base thickness Tb values of 0.3 mm (FIG. 15A), 0.6 mm (FIG. 15B),1.2 mm (FIG. 15C), and 2.4 mm (FIG. 15D). As shown in FIG. 15A, for aseal band width Wp of 2 mm, the total thermal resistance was nearlyconstant for active cooler widths W_(AA) between 20 and 22.5 mm (i.e.within a few percent of the minimum value). Moreover, FIGS. 15B˜15Dillustrate that as the cooler base thickness Tb is increased, theminimum value for a fixed seal band width Wp increases slightly, due tothe temperature drop in the thicker copper base. With a 2 mm seal band,in all cases, reducing the active area to 20 mm resulted in an increasein the thermal resistance by a maximum of 2% from the minimum value andin most cases by less.

For the case of a 1 mm seal band width Wp, the thermal resistance isshown to be nearly constant, or slightly increase, when the active areais reduced to 20.5 mm. When the active cooled area is less than 20 mmwide, the thermal resistance is shown to increase sharply as the sealband region does not extend to the edge of the chip. The total thermalresistance slowly increases for active areas greater than about 22 mmbecause the average fluid velocity inside the cooler active volumedecreases hence reducing the local heat transfer coefficient between thefluid and the microstructure inside the cooler. The performance is foundto be further reduced by increasing the amount of coolant bypassing thechip along the sides of the cooler and which is heated to a lesserdegree than coolant which passes directly over the chip. Similar trendscan be observed for the 0.5 mm and 0.2 mm seal band results. When nomanifold region is present, or along the sides of the cooler withoutmanifold regions, the active cooler size is preferably smaller than thechip size but the active cooler width plus the seal band widths ispreferable equal to or somewhat greater than the chip size.

The above discussion suggests that a minimum base thickness isdesirable, but the modeling results in FIGS. 15A˜15D do not considercooler devices having manifold regions at opposite ends of the activeregion before the perimeter seal region is reached (as in FIG. 12B)Depending on the cooler framework, such manifold regions may, or maynot, be necessary. If manifold regions are present at the end of theactive regions before the perimeter seal, then the width of the manifoldregion between the active region and the perimeter seal is preferablyless than one to two times the base thickness of the cooler (e.g. if thebase is 0.5 mm thick, the manifold region should be no more than 1 mmwide). Such a relationship allows heat spreading in the base to provideadequate cooling under the manifold region and would permit the activearea of the cooler to be smaller than the chip area. An alternatesolution would be to have the active area of the cooler be smaller thanthe cooler in the direction perpendicular to the coolant flow directionto reduce cooler size and cost, but be nearly equal, or equal to, thechip size in the direction parallel to the coolant flow.

Although illustrative embodiments have been described herein withreference to the accompanying drawings, it is to be understood that thepresent system and method is not limited to those precise embodiments,and that various other changes and modifications may be affected thereinby one skilled in the art without departing from the scope or spirit ofthe invention. All such changes and modifications are intended to beincluded within the scope of the invention as defined by the appendedclaims.

What is claimed is:
 1. An electronic apparatus, comprising: a flexiblechip carrier substrate having an IC (integrated circuit) chip flip-chipmounted on a first surface of the flexible chip carrier substrate and anarea array of electrical contacts formed on a second surface of theflexible chip carrier substrate opposite the first surface; a metalliccooler device having upper and lower opposing surfaces and sidewallsurfaces, wherein the lower surface of the metallic cooler device isthermally bonded directly to a backside surface of the IC chip; and astiffener member that is bonded to the first surface of the flexiblechip carrier substrate and is configured to provide mechanical rigidityto the flexible chip carrier substrate, wherein the metallic coolerdevice is mechanically coupled to the flexible chip carrier substrate bythe stiffener member, and wherein the stiffener member comprises: aplanar frame portion that lies substantially flat against the flexiblechip carrier substrate; and a plurality of extended portions that areintegrally formed with the planar frame portion and extend toward themetallic cooler device and away from the flexible chip carrier substrateat a first angle, wherein each the plurality of extended portionsincludes a bent end portion that is bent with respect to the rest of theextended portions at a second angle, the bent end portions are incontact with the sidewall surfaces of the metallic cooler device, thebent end portions of the plurality of extended portions being integrallyformed with the rest of the extended portions.
 2. The apparatus of claim1, wherein the metallic cooler device is thermally bonded to thebackside of the IC chip using a layer of mechanically compliantthermally conductive material or adhesive thermal bonding material. 3.The apparatus of claim 1, wherein the metallic cooler device isthermally bonded to the backside of the IC chip using a soft solderbond.
 4. The apparatus of claim 1, wherein the planar frame portion ofthe stiffener member is adhesively bonded to an outer peripheral regionof the first surface of the carrier substrate.
 5. The apparatus of claim1, wherein the bent end portions of the extended portions of thestiffener member are bonded to the sidewall surfaces of the metalliccooler device using an adhesive bonding material or solder.
 6. Anelectronic apparatus, comprising: a flexible chip carrier substratehaving an IC (integrated circuit) chip flip-chip mounted on a surface ofthe flexible chip carrier; a metallic cooler device having upper andlower opposing surfaces and sidewall surfaces, wherein the lower surfaceof the metallic cooler device is thermally bonded directly to a backsidesurface of the IC chip; and a stiffener member that is bonded to thefirst surface of the flexible chip carrier substrate and is configuredto provide mechanical rigidity to the flexible carrier substrate,wherein the metallic cooler device is mechanically coupled to theflexible chip carrier substrate by the stiffener member, and wherein thestiffener member comprises: a rectangular planar frame portion that liessubstantially flat against the flexible chip carrier substrate; and aplurality of extended portions that are integrally formed with therectangular planar frame portion and extend toward the metallic coolerdevice and away from the flexible chip carrier substrate at a firstangle, wherein each the plurality of extended portions includes a bentend portion that is bent with respect to the rest of the extendedportions at a second angle, the bent end portions are in contact withthe sidewall surfaces of the metallic cooler device, the bent endportions of the plurality of extended portions being integrally formedwith the rest of the extended portions, and wherein the plurality ofextended portions are disposed against the metallic cooler device with acompressive force such that the metallic cooler device is configured toreceive a downward tension directly from the plurality of extendedportions.
 7. The apparatus of claim 6, wherein the metallic coolerdevice is thermally bonded to the backside of the IC chip using a layerof mechanically compliant thermally conductive material or adhesivethermal bonding material.
 8. The apparatus of claim 6, wherein themetallic cooler device is thermally bonded to the backside of the ICchip using a soft solder bond.
 9. The apparatus of claim 6, wherein therectangular planar frame portion of the stiffener member is adhesivelybonded to an outer peripheral region of the surface of the carriersubstrate.
 10. The apparatus of claim 6, wherein the bent end portionsof the extended portions of the stiffener member are bonded to thesidewall surfaces of the metallic cooler device using an adhesivebonding material or solder.